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NEC's 4-PIN ULTRA SMALL FLAT-LEAD, LOW OUTPUT CAPACITANCE PS7801-1A 1-CH OPTICAL COUPLED MOSFET
FEATURES
* LOW C x R : C x R = 12.6 pF * * LOW OUTPUT CAPACITANCE COUT = 1.2 pF * 1 CHANNEL TYPE: 1a output * DESIGNED FOR AC/DC SWITCHING LINE CHANGER * ULTRA SMALL FLAT-LEAD PACKAGE: 4.2 (L) X 2.5 (W) X 1.85 (H) mm * LOW OFFSET VOLTAGE * ORDERING NUMBER OF TAPING PRODUCT: PS7801-1A-F3, F4 (3 500 pcs/reel) It is suitable for high frequency signal control, due to its low C x R, low on-state resistance, and low off-state leakage current.
DESCRIPTION
NEC's PS7801-1A is a low output capacitance solid state relay containing GaAs LEDs on the light emitting side (input side) and MOSFETs on the output side. An ultra small at-lead package has been provided which realizes a reduction in mounting area about 50% compared with the PS72xx series.
APPLICATIONS
* MEASUREMENT EQUIPMENT
ELECTRICAL CHARACTERISTICS (TA = 25 C)
PART NUMBER SYMBOLS Diode VF IR MOS FET ILOFF Cout Coupled IFon RON1 RON2 tON tOFF RI-O CI-O PARAMETERS Forward Voltage, IF = 5 mA Reverse Current, VR = 5 V Off-State Leakage Current, VD = 40 V Output Capacitance, VD = 0 V, f = 1 MHz LED On-state Current IL = 100 mA On-State Resistance, IF = 5 mA, IL = 10 mA On-State Resistance, IF = 5 mA, IL = 100 mAt 10 ms Turn-on Time, IF = 5 mA, VO = 5 V, RL = 500 Turn-off Time, IF = 5 mA, VO = 5 V, RL = 500 Isolation Resistance, VI-O = 0.5 k VDC Isolation Capacitance, V = 0 V, f = 1 MHz , PW 10 ms , PW 10 ms 109 0.3 pF 10.5 11.5 0.02 0.15 0.1 1.2 2.0 14 15 0.5 1.0 ms ms MIN PS7801-1A TYP 1.1 MAX 1.4 5.0 1 UNITS V A nA pF mA
1. Test Circuit for Switching Time
IF Pulse Input VL
Input
50% 0
VO = 5 V
Input monitor Rin RL Vo monitor
90%
Output 10% ton toff
2. The turn-on time and turn-off time are specied as input-pulse width 10 ms. Please note that when the device operates with an input-pulse of under 10 ms, the turn-on time and turn-off time will increase.
California Eastern Laboratories
PS7801-1A ABSOLUTE MAXIMUM RATINGS1 (TA = 25C)
Input SYMBOLS IF VR PD IFP VL IL ILP PD Viso PT TA TSTG PARAMETERS RATINGS UNITS mA V mW A V mA mA mW V mW C C Forward Current (DC) 50 Reverse Voltage 5 Power Dissipation 50 Peak Forward Current2 1 Break Down Voltage 40 Continuous Load Current 100 Pulse Load Current3 200 Power Dissipation 250 Isolation Voltage4 500 Total Power Dissipation 300 Operating Ambient Temp. -40 to +85 Storage Temperature -40 to +100
RECOMMENDED MOUNT PAD DIMENSIONS
(Units in mm) 1.27 (0.35) 0.8 0.6
Output
3.6
Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. PW = 100 s, Duty Cycle = 1 % 3. PW = 100 ms, 1 shot 4. AC voltage for 1 minute at TA = 25C, RH = 60% between input and output
ORDERING INFORMATION
PART NUMBER PS7801-A-F3 PS7801-A-F4 PACKAGE 4-PIN SSOP PACKING STYLE Embossed Tape 3 500 pcs
24-R0.1
RECOMMENDED OPERATING CONDITIONS
SYMBOL IF VF PARAMETER LED Operating Current LED Off Voltage UNITS IF VF MIN 2 0 5
(TA = 25C) MAX 20 0.5
TYP
OUTLINE DIMENSIONS (Units in mm)
2.50.3 4 3 4 0.2 MAX.
TOP VIEW
3 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET 1 2
4.2 0.2
N
0.2 0.1 1 2
4.8 MAX. 1.850.05
+0.1 -0.05
0.40.1 1.27
0.15
0.20.1
0.36
3.6
+0.3 -0.4
4.4
5.3
PS7801-1A TYPICAL CHARACTERISTICS
(TA = 25C)
MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE
100 150
MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE
Maximum Forward Current, IF (mA)
80
Maximum Load Current, IL (mA)
100
60
40
50
20
0 -25
0
25
50
75 85
100
0 -25
0
25
50
75 85
100
Ambient Temperature, TA (C)
Ambient Temperature, TA (C)
FORWARD VOLTAGE vs. AMBIENT TEMPERATURE
1.6 5.0
OUTPUT CAPACITANCE vs. APPLIED VOLTAGE
f = 1 MHz
Output Capacitance, Cout (pF)
Forward Voltage, VF (mA)
4.0
1.4 IF = 50 mA 1.2 30 mA 20 mA 10 mA 5 mA 1 mA
3.0
2.0
1.0
1.0
0.8 -25
0
25
50
75
100
0
10
20
30
40
50
60
Ambient Temperature, TA (C)
Applied Voltage, VD (V)
OFF-STATE LEAKAGE CURRENT vs. AMBIENT TEMPERATURE
10
-7
LOAD CURRENT vs. LOAD VOLTAGE
IF = 5 mA
Off-state Leakage, Current IF (mA)
VD = 40 V 10
-8
200
Load Current, IL (mA)
10
-9
100
10
-10
-2.0
-1.0
0 -100
1.0
2.0
10
-11
10
-12
-200 10
-13
0
20
40
60
80
100
Ambient Temperature, TA (C)
Load Voltage, VL (V)
PS7801-1A TYPICAL CHARACTERISTICS
(TA = 25C)
NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE
3.0
ON-STATE RESISTANCE DISTRIBUTION
60
Normalized On-state Resistance, Ron
2.5
Maximum Load Current, IL (mA)
Normalized to 1.0 at TA = 25C, IF = 5 mA IL = 10 mA
50
n = 50 pcs, IF = 5 mA IL = 10 mA
2.0
40
1.5
30
1.0
20
0.5 0.0 -25
10
0
25
50
75
100
0 9.5 10.0 10.5 11.0 11.5
Ambient Temperature, TA (C)
On-state Resistance, Ron ( )
TURN-ON TIME vs. FORWARD CURRENT
0.10 VO = 5 V, RL = 500
TURN-ON TIME vs. FORWARD CURRENT
0.5 VO = 5 V, RL = 500 0.4
Turn-on Time, ton (ms)
Turn-off Time, toff (ms)
0.08
0.08
0.3
0.06
0.2
0.02
0.1
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Forward Current, IF (mA)
Forward Current, IF (mA)
TURN-ON TIME DISTRIBUTION
60 n = 50 pcs, IF = 5 mA, VO = 5 V, RL = 500 60
TURN-OFF TIME DISTRIBUTION
n = 50 pcs, IF = 5 mA, VO = 5 V, RL = 500
50
50
Number (pcs)
30
Number (pcs)
40
40
30
20
20
10
10
0 0.01 0.02 0.03 0.04 0.05
0 0.05 0.10 0.15 0.20 0.25
Turn-on Time, Ton (ms)
Turn-off Time, toff (ms)
PS7801-1A TYPICAL CHARACTERISTICS
(TA = 25C)
NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE
3.0 Normalized to 1.0 at TA = 25 C 2.5 VO = 5 V, RL = 500 2.0 3.0
NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE
Normalized to 1.0 at TA = 25 C, IF = 5 mA VO = 5 V, RL = 500
Normalized Turn-off Time, toff
Normalized Turn-on Time, ton
2.5
2.0
1.5
1.5
1.0
1.0
0.5
0.5
0.0 -25
0
25
50
75
100
0.0 -25
0
25
50
75
100
Ambient Temperature, TA (C)
Ambient Temperature, TA (C)
PS7801-1A TAPING SPECIFICATIONS
(Units in mm)
Outline and Dimensions (Tape)
2.00.05 4.00.1 1.5 +0.1 -0 1.750.1
2.9 MAX 5.50.05 12.00.2
5.30.1
0.3 1.550.05 4.00.1 2.90.1 2.40.1
Tape Direction
PS7801-1-F3 PS7801-1-F4
N
N
N
N
Outline and Dimensions (Reel)
2.00.5
3302.0 1001.0
2.00.5 13.00.2
R 1.0
21.00.8
13.00.2
Packing: 3 500 pcs/reel
N
N
N
N
13.51.0 17.51.0
11.9 to 15.4 Outer edge of flange
PS7801-1A RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering * Peak reflow temperature 260 uC (package surface temperature) * Time of Peak reflow temperature 10 seconds or less * Time of temperature higher than 220 C 60 seconds or less * Time to preheat temperature from 120 to 180 C 12030 s * Number of reflows Three * Flux Rosin ux containing small amount of chlorine (The ux with a max. chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperatire T (C)
(heating) t0 10 s 260 C MAX. 220 C to 60 s 180 C 120 C 12030 s (preheating)
(2) Wave soldering * Temperature 260 uC or below (molten solder temperature) * Time 10 seconds or less * Preheating conditions 120uC or below (package surface temperature) * Number of times One
Time (s)
* Flux Rosin ux containing small amount of chlorine (The ux with a max. chlorine content of 0.2 Wt % is recommended.) (3) Cautions * Fluxes Avoid removing the residual ux with freon-based and chlorine-based cleaning solvent.
Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.
03/16/2004
A Business Partner of NEC Compound Semiconductor Devices, Ltd.

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